SON-8 Breakout Board (4 x 4 mm, 0.8 mm)

Description

This is a breakout board that was designed to be a DIP adapter for the SON-8 type SMD packages. Some of the SMD types that can be used with this board include: VSO, XSON, HVSON, HWSON, HXSON.
Technical Details
Footprint Dimensions
Body (mm):
4 x 4
Pitch (mm):
0.8
Thermal Pad (mm):
n/a
Breakout Board Dimensions
Board Dimensions (mil):
420 x 460
Board Thickness (mil):
62
Through-Hole Spacing (mil):
300 mil (X-axis)
100 mil (Y-axis)
Breakout Board Specifications
Board Layers:
2
Finish:
Immersion Gold
Copper:
1 oz
Traces (mil)
10
Trace Lengths (mil):
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Pin/Through-Hole Count:
8
What's Included?
Parts Installed on Board:
None
Parts Included
(but not installed):
8 PIN Break Away Header (Straight)
Additional Features
Easily identifiable PIN 1 indicator and PIN numbers
White silk “Label Pads” allow you to label the pins for quick reference
Extended through-hole pads make for an easy connection point for surface mount parts
Breadboard friendly pin spacing
All boards have been E-tested for failures and are RoHS compliant